Two locations, three lines
Taiyuan and Jincheng support two 4-inch lines and one 6-inch compound-semiconductor line.
III–V antimonide optoelectronic platforms
Antimonide
optoelectronics,
end to end
Precision in chips · Intelligence in light · Vision for the future.
GK Semicoductor connects the lattice-matched 6.1 Å InAs·GaSb·AlSb material platform with epitaxy, device engineering, packaging and system integration.
Technology Platform
From epitaxy to delivery.
Material growth, wafer process, packaging and system integration are connected in one engineering chain.
About / Core Capabilities
A full‑chain IDM platform for next‑generation infrared photonics.
Founded in 2020, GK Semicoductor is a frontier optoelectronic wafer and chip developer and manufacturer focused on III‑V compound semiconductors, particularly antimonide materials and superlattice structures.
2020
Founded around III‑V antimonide and superlattice optoelectronics.
20,000 m²
Modern semiconductor fabrication and cleanroom footprint.
2×4″ + 1×6″
Three compound‑semiconductor process lines.
7 systems
InAs, GaSb, InGaAs, InAsSb, GaAs, InP and InSb.
Research collaborations & platform credentials
- National Semiconductor Laser Innovation Center
- CAS Institute of Semiconductors
- Taiyuan First Laboratory
- Shanxi Key Laboratory
Applications
One III-V platform,
applied across four fields.
Imaging, quantum measurement, laser processing and AI optical interconnect share one connected III-V platform.
Featured Products
Three products from the formal catalog.
A long-focal MWIR system, a megapixel cooled detector and a high-power semiconductor laser bar from the published 55-product catalog.
Manufacturing & Quality
Built for connected manufacturing and delivery.
Two locations in Taiyuan and Jincheng connect three compound-semiconductor lines with epitaxy, device engineering, packaging and system integration.
20,000+ m² footprint
Cleanroom and manufacturing space supports the documented engineering and production chain.
Connected engineering chain
Material growth, device engineering, packaging and system integration are organized as one platform.
Seven material systems
InAs, GaSb, InGaAs, InAsSb, GaAs, InP and InSb are represented in the source record.