III–V antimonide technology

One material platform, engineered through the chain.

GK Semicoductor connects the 6.1 Å InAs · GaSb · AlSb material system with epitaxy, device engineering, packaging and module integration.

Compound-semiconductor wafer under probe inspection

01 / Platform foundation

One material system. Two technology routes.

A lattice-matched 6.1 Å material foundation supports optoelectronic products today and a defined frontier route for high-speed electronics.

Optoelectronic wafer characterization
Route 01

Optoelectronics

Infrared detectors, semiconductor lasers, quantum light sources and precision measurement devices.

GaSb · T2SL · QCL / ICL
Frontier high-speed electronics wafer under RF probe testing
Route 02

Frontier electronics

High-mobility heterojunctions for terahertz, high-frequency and low-power logic devices.

HEMT · TFET · DHBT

02 / Full-chain engineering

From epitaxy to delivery.

Material growth, wafer process, packaging and system integration are connected in one engineering chain.

Molecular beam epitaxy equipment
EpitaxyMaterial design and molecular beam epitaxy establish the device foundation.

03 / Product evidence

Performance, made measurable.

The source material provides device-level evidence across detector arrays and semiconductor laser products.

T2SL infrared detector array
Infrared detector

T2SL infrared detectors

Array formats, higher operating temperature and very-long-wave response are documented in the technical record.

1024×1024Array format
>195 KMWIR BLIP
>16 µmVLWIR cut-off
Semiconductor laser source
Semiconductor laser

Semiconductor laser sources

Single emitters, bars and integrated modules provide a measured path from narrow-linewidth sources to high-power output.

18.4 WBar
172 WModule
53 dBSMSR

04 / Manufacturing and delivery

Built for scaled delivery.

The technical record supports a connected manufacturing base across epitaxy, wafer process, packaging and module delivery.

Compound-semiconductor cleanroom and manufacturing equipment
2×4″ + 1×6″Compound-semiconductor production lines
20,000+ m²Cleanroom and manufacturing footprint
7Material systems represented in the source record