GK Semi

Infrared Detectors

CS1210M/L26A

Megapixel High-Temperature MWIR Detector

Megapixel clarity · High-temperature, low-power operation | The thermal core for high-end civil payloads and long-range NDT.

CS1210M/L26A product photograph
Resolution1280 × 1024
Pixel pitch10 μm
Spectral range3.7–4.8 μm
NETD≤22 mK
Frame rate50 / 100 Hz

01 / Product introduction

Product introduction

Combining type-II superlattice (T2SL) high-operating-temperature chip technology with a 10 μm small-pixel process, this detector reaches 1280 × 1024 resolution while lifting chip operating temperature to 130 K. Breaking past the temperature limits of conventional cooled detectors, it cools down in ≤4 min and holds steady-state draw to ≤6 W. The 10 μm pixel pairs with shorter, lighter lenses to cut overall size and weight — built for high-end civil UAV gimbals, long-range perimeter security and precision industrial NDT.

02 / Core application scenarios

Core application scenarios

01
High-end civil UAVs and unmanned systemsUltra-light high-definition electro-optical gimbals, high-altitude forest-fire patrol, long-range ecological protection and wildlife monitoring.
02
Industrial NDT and researchMicron-scale thermal-defect analysis of wafers and chips, advanced-material thermal-stress testing and laboratory spectral imaging.
03
Power and pipeline inspectionVery-long-range fault screening on high-voltage grids, aerial patrol of oil and gas pipelines and thermal-anomaly identification.
04
Smart border and campus perimeter securityCivil coastline monitoring, airport perimeter protection, smart ports and 24-hour high-definition night vision for large industrial parks.

03 / Core advantages

Core advantages

01
Megapixel detailA 1280 × 1024 array on a 10 μm pitch widens the field of view and sharpens detail, keeping distant small targets clearly distinguishable.
02
High-temperature operationA 130 K chip operating temperature lowers cooling demand and extends endurance for electro-optical and handheld payloads.
03
Lightweight optics compatibilityThe 10 μm pixel substantially shrinks front-end lens diameter and focal length for a markedly lighter, smaller system.
04
High sensitivity and consistencyAn NETD of ≤22 mK and operability of ≥99.7% output smooth, noise-free high-definition thermal imagery around the clock.

04 / Core technical specifications

Core technical specifications

Resolution
1280 × 1024
Pixel pitch
10 μm
Spectral range
3.7–4.8 μm
NETD
≤22 mK
Frame rate
50 / 100 Hz
F-number
F/2 / F/4
Cooldown
≤4 min
Power
≤15 W peak
Weight
≤350 g

04 / Project integration

Integration essentials

F-number
F/2 / F/4
Cooldown
≤4 min
Power
≤15 W peak
Weight
≤350 g