GK Semi

Laser Products

1310-70M-CW

1310 nm DFB Laser Chip

Single-longitudinal-mode, narrow linewidth · Strong feedback tolerance | Enabling silicon photonics and AI data centres.

1310-70M-CW product photograph
Wavelength1311 ± 6.5 nm
Output70 mW
Operating modeCW
Spectral width0.2 nm FWHM
Pulse / dutyContinuous wave

01 / Product introduction

Product introduction

This 1310 nm CW DFB (distributed feedback) laser chip is built on an advanced InP multi-quantum-well epitaxial structure with grating feedback. Single-longitudinal-mode output, a high side-mode suppression ratio, high conversion efficiency and very low relative intensity noise make it well suited as an external CW light source (ELS) for 800G / 1.6T silicon-photonics transceivers, co-packaged optics (CPO) and fiber communication systems.

02 / Core application scenarios

Core application scenarios

01
Silicon-photonics modulesExternal CW light sources for 400G / 800G / 1.6T silicon-photonics modules in AI compute data centres.
02
CPO and optical interconnectNext-generation high-density co-packaged optics (CPO) and board-level optical interconnect systems.
03
Fiber communication and transport5G fronthaul and midhaul, plus metro and datacom O-band fiber communication systems.
04
Precision fiber sensing and testDistributed fiber sensing (DAS/DTS), optical time-domain reflectometry (OTDR) and optical test instrumentation.

03 / Core advantages

Core advantages

01
70 mW CW output70 mW of continuous output at 250 mA drive, with low series resistance and high slope efficiency to limit power draw in densely packaged assemblies.
02
Single-mode spectral purityA 0.2 nm FWHM linewidth at 1311 ±6.5 nm delivers excellent monochromaticity and low coherent noise for high-speed signal integrity.
03
Uncooled high-temperature operationOptimised temperature characteristics support stable continuous operation at junction temperatures up to 85 °C without cooling, with threshold current held below 90 mA at 75 °C.
04
Beam geometry for couplingDivergence of 22° fast axis and 20° slow axis from a 2.5 μm emitting width supports efficient coupling into silicon-photonics waveguides.

04 / Core technical specifications

Core technical specifications

Wavelength
1311 ± 6.5 nm
Output
70 mW
Operating mode
CW
Spectral width
0.2 nm FWHM
Pulse / duty
Continuous wave
Drive
250 mA / 1.4 V
Thermal control
-5–85 °C
Package
DFB laser chip
Output interface
Free-space / package dependent

04 / Project integration

Integration essentials

Drive
250 mA / 1.4 V
Thermal control
-5–85 °C
Package
DFB laser chip
Output interface
Free-space / package dependent